| Color: | Red |
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| Application: | Transportation Tools, Door & Window, Decorations |
| Certification: | ISO9001, ASTM, JIS, GB, EN |
| Technique: | Cold Drawn |
| Grade: | 1000 Series |
| Temper: | O |
| Samples: |
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| Customization: |
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| Self bonding copper wire types | Thermo forming | Polyamide (Provide a variety of different characteristics of the polyamide as the self-bonding layer of the self-bonding line. Compared with other kinds of self-bonding layer, polyamide has higher self-bonding strength. In addition, some polyamide self-bonding wires have higher re softening temperature. However, some polyamide self-bonding wires are hygroscopic and are difficult to use in hot and humid climates.) | Solvent type |
| Butyral (The self-bonding wire with polyvinyl butyral adhesive layer is easy to process and is widely used in various occasions. This kind of self-bonding wire has two advantages: low self-bonding temperature required for coil bonding and wide processing conditions.) | Hot air type | ||
| Polyester (The self-bonding layer of polyester is easy to process. The wire has good adhesion and good wet adhesion resistance, and is widely used in ultrasonic implant processing.) | Electric heating type | ||
| Heat hardenability | Polymide (Provide a variety of different characteristics of the polyamide as the self-bonding layer of the self-bonding line. Compared with other kinds of self-bonding layer, polyamide has higher self-bonding strength. In addition, some polyamide self-bonding wires have higher re softening temperature. However, some polyamide self-bonding wires are hygroscopic and are difficult to use in hot and humid climates.) | ||
| Epoxy (The self-bonding wire with epoxy layer needs high current heating when bonding. The coil has good adhesion and heat resistance, so it is used in power on machining.) | |||
| self bonding solutions | |||
| Types | Advantages | Disadvantages | Risks |
| Hot air self-bonding: hot air is in the winding process by blowing hot air on the line to achieve self-bonding effect. The temperature of hot air at winding is usually between 120 ºC and 230 ºC, which depends on wire diameter, winding speed and winding shape and size. This method is suitable for most applications. | 1. Fast 2. Stable and easy to process 3. Easy to automate |
Suitable for thin wire only. | Tool pollution |
| Oven self-bonding: oven self-bonding is achieved by putting the coil of finished product into the oven for heating. According to the shape and size of the coil, the temperature of the oven usually needs to be between 120 ºC and 220 ºC, and the time required is 5 to 30 minutes. Due to the long time required, oven self-bonding may be uneconomical for some applications. | 1. It can be suitable for post baking heat treatment 2. Suitable for multilayer coils |
1. High cost 2. Long time operation. |
Tool pollution |
| Solvent self-bonding: solvent self-bonding is to achieve self-bonding effect by adding appropriate solvent (such as industrial alcohol) to the wire during winding. The solvent can be brushed, sprayed or coated on the winding during winding. The typical recommended solvent is ethanol or methanol (the concentration is 80-90%). The solvent can be diluted with water, but the more water is used, the more difficult the self-bonding process will be. | The equipment and process are simple | 1. Solvent emissions 2. Not easy to automate |
1. Residual solvents may damage the insulation 2. It is difficult to dry the inner layer of the coil with more layers. It is usually necessary to use an oven to completely volatilize the residual solvent after self-bonding |
| Power on self-bonding: power on self-bonding is realized by electric current (resistance heating). The required current intensity depends on the shape and size of the coil. Power on self-bonding is recommended for products with wire diameter greater than 0.10 mm (38awg), but special care should be taken not to overheat the center of the winding, as excessive temperature may damage the insulation and cause short circuit. | 1. Fast process and high energy efficiency 2. Easy to automate |
1. It is difficult to find a suitable process 2. Not suitable for specifications below 0.10 mm |
The application of excessive current will cause the temperature to be too high |
| General Introduction | Heat resistance | Electrician value | Mechanical behavior | ||||
| IEC Standard/ NEMA | IEC 60317-51 IEC 60317-35/IEC 60317-3 | Temperature index (°C) | 180 | Film continuity(according to IEC 60851-5.1) | Elongation | ||
| 0.05mm(typical) | 20% | ||||||
| 0.25mm(typical) | 35% | ||||||
| Tensile strength | 220-300 [N/mm²] | ||||||
| 1 paint film | ≤8 | Self sticking performance | |||||
| 2 kinds of paint film | ≤6 | Solvent bonding | Suitable/Not Suitable/Limited | ||||
| 3 paint films | ≤5 | Recommended solvent | Ethanol/methano/No | ||||
| Insulation type | Polyurethane/Polyeste | Cut through temperature | ≥230ºC | Breakdown voltage (at temperatures of 20 & deg; C and relative humidity of 35%) | Recommended bonding temperature | 150~170ºC | |
| Resoftening temperature | ≥150ºC | ||||||
| Self-adhesive layer type | Polyamide | Heat shock | ≥200ºC | 0.05mm Typical value | 150 V/µm | ||
| 0.25mm Typical value | 100 V/µm | ||||||
| Diameters available | 0.016~0.60 | Solderability | Pinhole characteristics (according to JIS C3003.6 standard) | Pinhole after stretching (non-standard) | |||
| Solderability | 2.0s/405ºC | ||||||
| Storage condition (0~30ºC/10%~70%) |
Non-hygroscopic/Hygroscopicity | 1 paint film | ≤3 | 1 paint film | ≤3 | ||
| 2 kinds of paint film | ≤5 | 2 kinds of paint film | ≤5 | ||||
| 3 paint films | ≤8 | 3 paint films | ≤8 | ||||
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