Copper Aluminum Clading Plate Sheet for Communication Equipment Substrate

Product Details
Customization: Available
Type: Copper Sheets
Application: Air Condition or Refrigerator, Water Tube, Oil Cooler Pipe, Communication Equipment Substrate
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Manufacturer/Factory, Trading Company
Diamond Member Since 2018

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Registered Capital
3000000 RMB
Plant Area
101~500 square meters
  • Copper Aluminum Clading Plate Sheet for Communication Equipment Substrate
  • Copper Aluminum Clading Plate Sheet for Communication Equipment Substrate
  • Copper Aluminum Clading Plate Sheet for Communication Equipment Substrate
  • Copper Aluminum Clading Plate Sheet for Communication Equipment Substrate
  • Copper Aluminum Clading Plate Sheet for Communication Equipment Substrate
  • Copper Aluminum Clading Plate Sheet for Communication Equipment Substrate
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Basic Info.

Model NO.
1100, 1050, 1060, 1070, 3003, 8011/T2
Shape
Plate
Alloy
Alloy
Standard
GB/T
Cladding Rate
100%
Tensile Strength
160-260MPa
Copper Ratio
10-20%
Transport Package
Export Standard Wooden Pallet
Specification
According to Customer Requirement
Trademark
Chalco Aluminum
Origin
Henan China
HS Code
7419999100
Production Capacity
10000mt/Month

Product Description

Copper Aluminum Clading Plate Sheet For Communication Equipment Substrate

Copper Aluminum Clading communication equipment substrateis mainly used in network base stations. At present, aluminum-copper plating technology is mainly used at home and abroad. However, aluminum-copper plating process is seriously polluted and production is limited.

Copper Aluminum Clading Plate Sheet For Communication Equipment Substrate
 produced by Henan Chalco is suitable for base station construction of 3G 4G 5G network, effectively replacing the traditional aluminum copper plating process. It can greatly improve product performance, reduce processing links, and is environmentally friendly, in line with the national green environmental protection needs.

Features: stable quality, safety and environmental protection, high production efficiency and low comprehensive processing cost.

 
Thickness Width Temper Bonding strength Copper ratio Tensile strength Elongation DC Resistivity
2.0-3.5mm 1000mm H18 12N/mm 10-20% 160-260MPa 10% <0.0245Ω.mm2/m
Copper Aluminum Clading Plate Sheet for Communication Equipment SubstrateCopper Aluminum Clading Plate Sheet for Communication Equipment SubstrateCopper Aluminum Clading Plate Sheet for Communication Equipment SubstrateCopper Aluminum Clading Plate Sheet for Communication Equipment SubstrateCopper Aluminum Clading Plate Sheet for Communication Equipment Substrate







 

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